Owners of the iPhone 15 series have begun to complain en masse that their phones overheat during fast charging and when using "heavy" and resource-consuming applications. Experts do not rule out that Apple will have to use software to limit the performance of the processors of these phones in order to avoid overheating of the device, The Wall Street Journal reports.
The company's technical support service, according to the source, is still trying to reassure iPhone 15 Pro and iPhone 15 Pro Max owners, saying that overheating during the operation of smartphones is caused by the intensity of the use of hardware resources of the phone and the installation and initial settings of the software, and then the problem must be adjusted.
However, not all buyers of these phones are ready to agree with these arguments. Experiments by WSJ representatives showed that a separate part of the iPhone 15 Pro Max case can heat up to 44 degrees Celsius when playing games while charging. By the way, in this respect it does not differ much from its predecessor, iPhone 14 Pro Max, which was tested in a similar scenario.
Well-known industry analyst Ming-Chi Kuo said that one of the reasons for iPhone 15 Pro and iPhone 15 Pro Max overheating could be its new titanium frame. First, titanium itself has poor thermal conductivity. Secondly, this is a fairly light metal, and this circumstance also worsens the thermodynamics of the smartphone.
It should be noted, however, that only the outer frame of Apple's new flagship phones is made of titanium, and the passages inside the case are made of aluminum. In the case of some testers, the smartphones of this series heated up to 50 degrees Celsius during intensive work.
iPhone 15 Pro users in China have experienced problems even when they tried to use messengers while charging. The device refused to charge, saying that the temperature inside the device is too high and needs to cool down.
Starting next year, as the sources note, Apple expects to switch to the use of printed circuit boards of a new composition, which, at the same time as reducing the thickness, will have an improved ability to dissipate heat.
According to other sources, adding a physical SIM card slot to the iPhone's design also required some layout compromises within the device, and these worsened heat dissipation conditions. According to Ming Chi Kuo, this problem of overheating of new smartphones can be solved only by limiting the performance of the processor and some other components through software.